A*STAR Institute of Microelectronics (A*STAR IME)

The A*STAR Institute of Microelectronics and Japan’s Shikino High-Tech Co., Ltd have united to develop improved technologies for motion sensing

A novel type of tilt sensor may extend the capabilities of ultrasonic devices already used in a range of applications

Single-chip integration of the components needed for sending and receiving terahertz radiation should help applications in imaging and communication

Researchers at A*STAR have made low-cost, ultrahigh-bandwidth telecommunication across continents a possibility through an innovative advance in silicon photonics

A computer model provides important clues for the production of tightly packed electronic components

Microscale medical sensors inserted under the skin can be powered wirelessly by an external handheld receiver

An aluminum–germanium alloy forges a tough, hermetic seal for electronics in extreme environments

The ability to miniaturize photonics devices to sizes compatible with computer chips inches closer

Development of an ultrafast photodetector that shows promise for integration with silicon chips could lead to increased fiber optical broadband speeds

Implantable medical devices may soon improve thanks to new developments in miniaturized pressure sensors

An unconventional design for a nanoscale memory device uses a freely moving mechanical shuttle to improve performance

The recently developed ability to measure physical changes in silicon when processed into microelectronic devices could improve fabrication techniques for even smaller circuits